RIX Industries Flow Downs

7/11/2017

Description:

PC Board IAW MIL-PRF-55110 and/or MIL-PRF-31032

Clause:

Printed wiring boards shall be constructed and tested in accordance with:A. MIL-PRF-31032 (Rigid and Flex) or MIL-PRF-55110B. MIL-P-50884C. IPC 6010 Series:• IPC 6010• IPC 6011• Rigid Printed Board Fabrication shall be per IPC 6012. If Class is not specified, Class 3 shallapply.• Flexible printed boards shall be per IPC-6013/MIL-P-50884. If Class is not specified, Class 3 shallapply.• IPC 6014D. L3Harris’ drawing 8147294E. L3Harris’ drawing 8193759F. L3Harris’ Drawing 8190126G. L3Harris’ Drawing A3012969 (Multi-Layer)H. L3Harris’ Drawing A3018534 (Double-Sided)I. L3Harris’ Drawing 8160638• The Seller shall provide one coupon from each printed wiring board panel with each shipment.Unless otherwise specified, the test specimens shall be processed at the same time andconditions and traceable for each uniform lot or batch processed.• Coupons requirements shall conform to the requirements of L3Harris’ specification.• Each part shall meet solderability requirements of MIL-STD-883 Method 2003, MIL-STD-202Method 208, and/or IPC-J-STD-003.• If required by the Purchase Order, the Seller shall perform Destructive Physical Analysis (DPA). Atest report and the test samples shall be delivered to L3Harris.